The new generation of Palladium baths

Gold, Silver, Platinum, Palladium and Rhodium: these are the "Magic 5', the five metals that are the spokespersons for an ethical choice rooted in Legor's DNA, adhering to the production requirements of the circular economy and the increasingly relevant demands of the consumers of the future. That is to say, all of Legor's alloys, powders and electroplating solutions are made exclusively from precious metals (Gold, Silver, Platinum, Palladium and Rhodium) that are 100 percent sourced from recycled sources and placed within the chain of custody.

We introduce the range of Palladium products offered by Legor starting with nickel-free alloys. A range of formulas suitable for all titles and processes based on those bleaching elements compatible with jewelry production. Palladium, together with silver, is the most widely used alternative to replace nickel in the production process, in every carat. Ni-free formulations are the only product category currently able to offer total compliance with the new UNI EN 1811:2015 standard. Legor best sellers include NF512 universal nickel-free master alloy for 750‰ (18 kt) and 585‰ (14 kt) white gold and NF 511, 510, 509 universal nickel-free master alloys for 18 kt white gold.

The other Legor product belonging to the new generation of palladium baths is PDSTARK-FE, specially developed to eliminate two other metal elements, nickel and cobalt, which are potentially harmful to health, from the production process. PDSTARK-FE is a palladium-based electroplating process that uses Iron as an alloying metal to generate white reflective and shiny surfaces. Palladium-iron deposition creates a ductile layer of constant 90/10 composition throughout, being able to be 10% less expensive than similar pure palladium thicknesses. The ready-to-use electroplating solution is free of free ammonia, making it easier to handle and maintain over time. Its decorative use is also combined with uses for protective purposes against surface oxidation and against external diffusion of copper from underlying layers.